Code,Index,Name,产业种类
32338,2,硅原材料,0
32445,8,光刻胶及其配套试剂,0
56341,9,蚀刻液,0
7,10,氟化硅,0
46504,11,显影液,0
32434,12,聚羧酸减水剂,0
32441,13,金属保护液,0
32444,14,深孔镀铜液,0
32440,15,稀释剂,0
32432,16,高纯硼酸（核电）,0
32451,17,电子级环氧树脂,0
46505,18,剥离液,0
32449,19,高纯金属有机化合物,0
32446,20,研磨液及配套化学品、研磨垫材料,0
32442,21,光阻去除剂,0
32433,22,多晶硅切削液,0
32443,23,钝化液,0
32450,24,电子级酚醛树脂,0
32435,25,表面活性剂,0
32437,26,磁性载体,0
32438,27,通用湿电子化学品,0
32447,28,电镀化学品及配套材料,0
32436,29,电子级阻燃材料及化学品,0
32448,30,液晶取向剂及配套化学品,0
32439,31,功能湿电子化学品,0
56320,32,磷化铟,0
56322,33,碳化硅,0
56319,34,砷化镓,0
56323,35,氮化镓,0
56321,36,氮化铝,0
8,37,氮化硅,0
36914,38,碳化硅衬底,0
36914,39,氮化镓衬底,0
36914,40,硅衬底,0
36914,41,氮化铝衬底,0
36914,42,深紫外LED衬底,0
36914,43,磷化铟衬底,0
32338,44,单晶硅片,0
32338,45,多晶硅片,0
32338,46,磷化铟单晶和单晶片,0
32338,47,碳化硅单晶和单晶片,0
32338,48,砷化镓单晶片,0
32338,49,氮化镓晶体和单晶片,0
32338,50,硅外延片,0
32338,51,碳化硅外延晶片,0
32338,52,氮化铝外延片,0
32338,53,氮化镓外延片,0
32338,54,磷化铟外延片,0
32338,55,LED外延片,0
2515,56,EDA及IP服务,2
2514,57,MPW服务,2
9,58,芯片设计,3
34535,59,涂胶显影设备,1
34526,60,硅片研磨机,1
34529,61,刻蚀机,1
34537,62,氧化/扩散炉,1
34534,63,晶圆测量设备,1
34525,64,单晶生长炉,1
34530,65,化学机械抛光设备,1
34533,66,光刻机,1
34527,67,晶硅切片机,1
34539,68,薄膜生长设备,1
34528,69,硅片倒角机,1
34543,70,等离子去胶机,1
34531,71,晶圆清洗机,1
34524,72,熔炼矿热炉,1
34532,73,半导体电镀设备,1
34538,74,离子注入设备,1
34550,75,切筋成型机,1
34555,76,探针卡,1
34554,77,测试机,1
34556,78,工艺检测设备,1
34557,79,晶圆检测设备,1
34553,80,探针台,1
34545,81,晶圆划片机,1
34552,82,分选机,1
34544,83,晶圆减薄机,1
34546,84,贴片机,1
34549,85,回流炉,1
34558,86,FT测试设备,1
34547,87,引线键合机,1
34551,88,植球机,1
34548,89,半导体塑封机,1
2717,90,功率半导体器件,1
2714,91,二极管,1
2715,92,晶体管,1
2716,93,晶闸管,1
2718,94,整流桥,1
317589,95,集成电路制造,1
10,96,IC封装,5
513738,97,芯片设计验证,4
513740,98,过程工艺检测,4
513742,99,晶圆测试,4
11,100,芯片测试,4
34573,101,晶圆凸块,0
34571,102,芯片粘结材料,0
34567,103,引线框架,0
34572,104,焊球,0
34566,105,封装基板,0
34569,106,半导体塑封料,0
34568,107,键合线,0
34570,108,底部填充料,0
34574,109,半导体切割材料,0
