mesa/input_data/input_product_data/BomNodes.csv

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Code,Index,Name,产业种类
2024-11-28 18:56:24 +08:00
32338,7,硅原材料,0
32445,8,光刻胶及其配套试剂,0
56341,9,蚀刻液,0
7,10,氟化硅,0
46504,11,显影液,0
32434,12,聚羧酸减水剂,0
32441,13,金属保护液,0
32444,14,深孔镀铜液,0
32440,15,稀释剂,0
32432,16,高纯硼酸(核电),0
32451,17,电子级环氧树脂,0
46505,18,剥离液,0
32449,19,高纯金属有机化合物,0
32446,20,研磨液及配套化学品、研磨垫材料,0
32442,21,光阻去除剂,0
32433,22,多晶硅切削液,0
32443,23,钝化液,0
32450,24,电子级酚醛树脂,0
32435,25,表面活性剂,0
32437,26,磁性载体,0
32438,27,通用湿电子化学品,0
32447,28,电镀化学品及配套材料,0
32436,29,电子级阻燃材料及化学品,0
32448,30,液晶取向剂及配套化学品,0
32439,31,功能湿电子化学品,0
56320,32,磷化铟,0
56322,33,碳化硅,0
56319,34,砷化镓,0
56323,35,氮化镓,0
56321,36,氮化铝,0
8,37,氮化硅,0
36914,38,碳化硅衬底,0
36914,39,氮化镓衬底,0
36914,40,硅衬底,0
36914,41,氮化铝衬底,0
36914,42,深紫外LED衬底,0
36914,43,磷化铟衬底,0
32338,44,单晶硅片,0
32338,45,多晶硅片,0
32338,46,磷化铟单晶和单晶片,0
32338,47,碳化硅单晶和单晶片,0
32338,48,砷化镓单晶片,0
32338,49,氮化镓晶体和单晶片,0
32338,50,硅外延片,0
32338,51,碳化硅外延晶片,0
32338,52,氮化铝外延片,0
32338,53,氮化镓外延片,0
32338,54,磷化铟外延片,0
32338,55,LED外延片,0
2515,56,EDA及IP服务,2
2514,57,MPW服务,2
9,58,芯片设计,3
34535,59,涂胶显影设备,1
34526,60,硅片研磨机,1
34529,61,刻蚀机,1
34537,62,氧化/扩散炉,1
34534,63,晶圆测量设备,1
34525,64,单晶生长炉,1
34530,65,化学机械抛光设备,1
34533,66,光刻机,1
34527,67,晶硅切片机,1
34539,68,薄膜生长设备,1
34528,69,硅片倒角机,1
34543,70,等离子去胶机,1
34531,71,晶圆清洗机,1
34524,72,熔炼矿热炉,1
34532,73,半导体电镀设备,1
34538,74,离子注入设备,1
34550,75,切筋成型机,1
34555,76,探针卡,1
34554,77,测试机,1
34556,78,工艺检测设备,1
34557,79,晶圆检测设备,1
34553,80,探针台,1
34545,81,晶圆划片机,1
34552,82,分选机,1
34544,83,晶圆减薄机,1
34546,84,贴片机,1
34549,85,回流炉,1
34558,86,FT测试设备,1
34547,87,引线键合机,1
34551,88,植球机,1
34548,89,半导体塑封机,1
2717,90,功率半导体器件,1
2714,91,二极管,1
2715,92,晶体管,1
2716,93,晶闸管,1
2718,94,整流桥,1
317589,95,集成电路制造,1
10,96,IC封装,5
513738,97,芯片设计验证,4
513740,98,过程工艺检测,4
513742,99,晶圆测试,4
11,100,芯片测试,4
34573,101,晶圆凸块,0
34571,102,芯片粘结材料,0
34567,103,引线框架,0
34572,104,焊球,0
34566,105,封装基板,0
34569,106,半导体塑封料,0
34568,107,键合线,0
34570,108,底部填充料,0
2024-11-28 18:56:24 +08:00
34574,109,半导体切割材料,0