10.09添加git
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201
input_data/input_product_data/BomNodes.csv
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201
input_data/input_product_data/BomNodes.csv
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Code,Index,Name,产业种类
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32338,7,硅原材料,0
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32445,8,光刻胶及其配套试剂,0
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56341,9,蚀刻液,0
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7,10,氟化硅,0
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46504,11,显影液,0
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32434,12,聚羧酸减水剂,0
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32441,13,金属保护液,0
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32444,14,深孔镀铜液,0
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32440,15,稀释剂,0
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32432,16,高纯硼酸(核电),0
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32451,17,电子级环氧树脂,0
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46505,18,剥离液,0
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32449,19,高纯金属有机化合物,0
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32446,20,研磨液及配套化学品、研磨垫材料,0
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32442,21,光阻去除剂,0
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32433,22,多晶硅切削液,0
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32443,23,钝化液,0
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32450,24,电子级酚醛树脂,0
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32435,25,表面活性剂,0
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32437,26,磁性载体,0
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32438,27,通用湿电子化学品,0
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32447,28,电镀化学品及配套材料,0
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32436,29,电子级阻燃材料及化学品,0
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32448,30,液晶取向剂及配套化学品,0
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32439,31,功能湿电子化学品,0
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56320,32,磷化铟,0
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56322,33,碳化硅,0
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56319,34,砷化镓,0
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56323,35,氮化镓,0
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56321,36,氮化铝,0
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8,37,氮化硅,0
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36914,38,碳化硅衬底,0
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36914,39,氮化镓衬底,0
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36914,40,硅衬底,0
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36914,41,氮化铝衬底,0
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36914,42,深紫外LED衬底,0
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36914,43,磷化铟衬底,0
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32338,44,单晶硅片,0
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32338,45,多晶硅片,0
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32338,46,磷化铟单晶和单晶片,0
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32338,47,碳化硅单晶和单晶片,0
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32338,48,砷化镓单晶片,0
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32338,49,氮化镓晶体和单晶片,0
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32338,50,硅外延片,0
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32338,51,碳化硅外延晶片,0
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32338,52,氮化铝外延片,0
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32338,53,氮化镓外延片,0
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32338,54,磷化铟外延片,0
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32338,55,LED外延片,0
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2515,56,EDA及IP服务,2
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2514,57,MPW服务,2
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9,58,芯片设计,3
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34535,59,涂胶显影设备,1
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34526,60,硅片研磨机,1
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34529,61,刻蚀机,1
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34537,62,氧化/扩散炉,1
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34534,63,晶圆测量设备,1
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34525,64,单晶生长炉,1
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34530,65,化学机械抛光设备,1
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34533,66,光刻机,1
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34527,67,晶硅切片机,1
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34539,68,薄膜生长设备,1
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34528,69,硅片倒角机,1
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34543,70,等离子去胶机,1
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34531,71,晶圆清洗机,1
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34524,72,熔炼矿热炉,1
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34532,73,半导体电镀设备,1
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34538,74,离子注入设备,1
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34550,75,切筋成型机,1
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34555,76,探针卡,1
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34554,77,测试机,1
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34556,78,工艺检测设备,1
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34557,79,晶圆检测设备,1
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34553,80,探针台,1
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34545,81,晶圆划片机,1
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34552,82,分选机,1
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34544,83,晶圆减薄机,1
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34546,84,贴片机,1
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34549,85,回流炉,1
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34558,86,FT测试设备,1
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34547,87,引线键合机,1
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34551,88,植球机,1
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34548,89,半导体塑封机,1
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2717,90,功率半导体器件,1
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2714,91,二极管,1
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2715,92,晶体管,1
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2716,93,晶闸管,1
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2718,94,整流桥,1
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317589,95,集成电路制造,1
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10,96,IC封装,5
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513738,97,芯片设计验证,4
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513740,98,过程工艺检测,4
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513742,99,晶圆测试,4
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11,100,芯片测试,4
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34573,101,晶圆凸块,0
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34571,102,芯片粘结材料,0
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34567,103,引线框架,0
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34572,104,焊球,0
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34566,105,封装基板,0
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34569,106,半导体塑封料,0
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34568,107,键合线,0
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34570,108,底部填充料,0
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34574,109,半导体切割材料,0
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56249,9,芯片设计,0
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56250,9,芯片设计,0
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49731,9,芯片设计,0
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49692,9,芯片设计,0
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49709,9,芯片设计,0
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49711,9,芯片设计,0
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49714,9,芯片设计,0
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34505,9,芯片设计,0
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34491,9,芯片设计,0
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34497,9,芯片设计,0
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49687,9,芯片设计,0
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34492,9,芯片设计,0
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49724,9,芯片设计,0
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49725,9,芯片设计,0
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49715,9,芯片设计,0
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49732,9,芯片设计,0
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49718,9,芯片设计,0
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49733,9,芯片设计,0
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34518,9,芯片设计,0
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49717,9,芯片设计,0
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49734,9,芯片设计,0
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34513,9,芯片设计,0
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49702,9,芯片设计,0
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56247,9,芯片设计,0
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49726,9,芯片设计,0
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49727,9,芯片设计,0
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34519,9,芯片设计,0
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49704,9,芯片设计,0
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49693,9,芯片设计,0
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34509,9,芯片设计,0
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34517,9,芯片设计,0
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34501,9,芯片设计,0
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49698,9,芯片设计,0
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49713,9,芯片设计,0
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49723,9,芯片设计,0
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49730,9,芯片设计,0
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49701,9,芯片设计,0
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49695,9,芯片设计,0
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49696,9,芯片设计,0
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34496,9,芯片设计,0
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34502,9,芯片设计,0
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34494,9,芯片设计,0
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49691,9,芯片设计,0
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49729,9,芯片设计,0
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49708,9,芯片设计,0
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49694,9,芯片设计,0
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49707,9,芯片设计,0
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49686,9,芯片设计,0
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49699,9,芯片设计,0
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49710,9,芯片设计,0
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49705,9,芯片设计,0
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34499,9,芯片设计,0
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49722,9,芯片设计,0
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49720,9,芯片设计,0
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49721,9,芯片设计,0
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49716,9,芯片设计,0
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56248,9,芯片设计,0
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34493,9,芯片设计,0
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49688,9,芯片设计,0
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49689,9,芯片设计,0
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49690,9,芯片设计,0
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34503,9,芯片设计,0
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49697,9,芯片设计,0
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49700,9,芯片设计,0
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34500,9,芯片设计,0
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49719,9,芯片设计,0
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49728,9,芯片设计,0
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49712,9,芯片设计,0
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34495,9,芯片设计,0
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34498,9,芯片设计,0
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431078,9,芯片设计,0
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431079,9,芯片设计,0
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431080,9,芯片设计,0
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431081,9,芯片设计,0
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431082,9,芯片设计,0
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431083,9,芯片设计,0
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431084,9,芯片设计,0
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431085,9,芯片设计,0
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431086,9,芯片设计,0
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431087,9,芯片设计,0
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431088,9,芯片设计,0
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317620,9,芯片设计,0
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317586,9,芯片设计,0
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513687,10,半导体封装,0
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513689,10,半导体封装,0
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513691,10,半导体封装,0
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513693,10,半导体封装,0
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513695,10,半导体封装,0
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513697,10,半导体封装,0
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513699,10,半导体封装,0
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513701,10,半导体封装,0
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513720,10,半导体封装,0
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513744,11,半导体测试,0
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513746,11,半导体测试,0
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513748,11,半导体测试,0
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513749,11,半导体测试,0
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513751,11,半导体测试,0
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